ADT 7220 SeriesFully Automatic Dicing System
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    7220 series Features & Benefits:


    Efficient Wafer Handling system streamlines wafers for greater productivity.

    Continuous Digital Magnification Vision system provides fast and accurate alignment for maximum throughput

    Blade Wear Prediction algorithm reduces height measurement time and increases UPH

    Touch Panel Display supports a user-friendly graphical interface (GUI)

    Atomized Wafer Cleaning technology for superior process results

    Dedicated Dressing Cassette to enable automatic blade dressing

    Built-in Inspection Tray for in-process quality assessment

    Small footprint


    单轴晶圆划片机7200系列可以使用的范围如下 :


    晶圆相关/玻璃材质/陶瓷材质/芯片封装/基板切割/其他精密切割加工等产品


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