Fully-automatic wafer grinder with down-feed grinding method and Robotics wafer handling. 8″ and 12″ grinder.Wafers are handled through the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind station. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2. A three-point grind spindle angle adjustment mechanism is utilized for easily maintaining wafer profile (ttv); with the option a motorized adjustment. The main motors are maintenance free AC servomotors. I/O data, grinding conditions, error messages are clearly visible on the GUI touch screen and downloadable through the computer. All computer logs are automatically saved for 30 days. SECS/GEM communication software is also available. In-line coin-stack, polish, or etch system may be directly connected to the GNX300B