OKAMOTO GNX200BPWafer Grinding
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    Characteristics of OKAMOTO GNX200BP 

    Model GNX200BP grinder is a fully automatic continuous downfeed grinding machine. Wafers are handled through the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind station. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2. A three-point grind spindle angle adjustment mechanism is utilized for easily maintaining wafer profile (ttv); with the option a motorized adjustment. After completion at the grind station, the wafer transfers to Polish unit automatically. The local polishing unit removes subsurface damage for increased wafer die strength, and the ability to handle final thickness of 50 microns.


    Maximum wafer-machining diameter of wafer

    Ø4” or Ø8”

    Grinding Spindle:  Bearing type

    Air bearing, maximum 3600 rpm

    Grinding Spindle:Motor

    2.2 kw, 4P, high frequency motor

    Rapid feed speed           

    200 mm/min

    Grind feed speed

    1 to 999 µm/min

    Grinding wheel size

    Ø250 mm

    Number of work spindles


    Work spindle Bearing type

    Mechanical Bearing, or Air Bearing (optional)

    Speed of Work Spindles

    1 to 600 rpm

    Wafer thickness measuring system

    2 point contact in-process gauge

    Wafer minimum setting size

    1 µm

    Wafer size display range

    0to 1.2 mm; extended range software available

    Table Cleaning Device (Grinder side)Water + Ceramic block
    Wafer Cleaning Unit (Grinder side)Water + brush, and spin/rinse dry station
    Number of Cassettes2 stations for each unit (Grinder & Polish unit)
    Polish table speed3 Kw AC servo motor for 50 – 200rpm
    Vacuum Chuck materialAlumina ceramics (dedicate size of wafer)
    Chuck cleaningBrush + Water

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