OKAMOTO GNX200BWafer Grinding
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    OKAMOTO GNX200B: 


            Model GNX200B grinder is a fully automatic continuous downfeed grinding machine. Wafers are handled through  the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind  station. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder  throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2. A three-point grind spindle angle adjustment mechanism is utilized for easily maintaining wafer profile (ttv); with the option a motorized adjustment. The main motors are maintenance free AC servomotors. I/O data,  grinding conditions, error messages are clearly visible on the GUI touch screen and downloadable through the computer.  All computer logs are automatically saved for 30 days. SECS/GEM communication software is also available. In-line coin-stack, polish, or etch system may be directly connected to the GNX200B.


    OKAMOTO GNX200B/GNX300B


    specifications

    GNX200B

    GNX300B

    Maximum machining diameter

    Ф200㎜

    Ф300㎜

    Spindle speed range

    0~3600rpm

    0~3000rpm

    Power of spindle drive motor

    2.2kW/4kW

    5.5kW/4kW

    Main shaft feed speed range

    1~999μm/min

    Spindle number

    2

    Working disc speed range

    1~300rpm

    Grinding wheel size

    Ф250㎜

    Ф300㎜

    Equipment weight

    3900kg

    5700kg



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