The TDM–LS(LAGER SCALE) is a versatile instrument for a wide array of applications in the areas of process development, failure analysis, reliability, and quality control. In order to present a complete product solution to the existing demand for warpage measurements, the TDM Large Scale complements the TDM Compact. The first generation of TDM was designed for surface analysis of relatively small area (up to 150x150 mm) while the TDM Large Scale offers surface inspection of areas up to 400x400 mm. Therefore the thermo-mechanical analysis of boards, wafers, and other large object becomes possible

   TDM is a patented tool for warpage analysis under a temperature profile. TDM uses the fringe projection technology (also called projection moiré) for non-contact, full-field acquisition of 3D topographies with a resolution as low as 1.5 µm. TDM-Compact acquires a full, absolute 3D cartography of devices with dimensions up to 600 mm x 430 mm. Simultaneously, its powerful heating and cooling capabilities allow for virtually any temperature profile on the sample under test. The integrated software package provides tools for representation of the results as 3D plots, vectors diagrams, isometrics views, and 2D profiles following user-defined profile lines (e.g., diagonal plots).