39-ICH08_ASEC低温焊接专用底填胶特点: |
This product which balanced curing agent. It is possible to obtain characteristic of both LOW CTE and LOW TEMP CURING.
39-ICH08_ASEC低温焊接专用底填胶Liquid state： |
Property | Typical Value | Test Condition |
Chemical | Epoxy (Black) |
|
Specific Gravity | 1.4 | @25˚C |
Thixotropic index | 1.0 | 12s-1 / 120s-1 |
Viscosity | 4.200 mPa・s | Cone plate type, 120s-1 |
39-ICH08_ASEC低温焊接专用底填胶Cured state： |
Property | Typical Value | Test Condition |
Tensile Modulus | 4.6 Gpa | 25˚C, DMA |
Tg | 120 ˚C | DMS |
CTE α1/α2 | 39/105 ppm/˚C | TMA |
Tensile shear strength | 16 Mpa | JIS K 6850 |
Volume resistivity | 2.28 x 1015Ω・cm | JIS K 6911 |
Surface resistivity | 9.7 x 1015Ω | JIS K 6911 |
Dielectric constant | 3.08 | 1.0GHz |
3.05 | 2.45GHz |
Dielectric loss tangent | 0.015 | 1.0GHz |
0.015 | 2.45GHz |
