ATW200pro Fully Automatic Wafer Taper 衡鵬企業

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AMSEMI ATW200proFully Automatic Wafer Taper

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ATW200pro Fully Automatic Wafer Taper Features：

Advanced ESD roller taping(roller heater as options)

Fully automatic tape feeding & inner Pre-cutting

Configure with multi link wafer transfer robot(Vacuum or Bernoulli arm)

Wafer position & warpage intelligent mapping

Fiber sensor for wafer pre-alignment

CCD for pre-cutted tape alignment

ESD Teflon plating chuck to handle various wafer (chuck heater optional)

Wafer cassette loading & Unloading(Wafer Box as options)

Standard industrial PC control with 17” touch panel LCD

Built-in Ionizers for ESD protection

Lower tension control technology for taping process

ATW200pro Fully Automatic Wafer Taper Specifications：

Wafer Size	Diameter:4”, 5”, 6”& 8” Thickness:50 ~ 725 um(Upgrade to handle thinner wafer capability)
Wafer Type	Si , GaAs Single Flat, Double Flat or V-Notch
Tape Type	Blue Tape or UV Tape or Lamination Tape etc. Width: 120 ~ 240 mm, Length: 100m, Thickness: 0.03 ~ 0.2 mm
Taping Chuck Temp.	Room Temp. ~ 100℃ Controllable (Optional)
Pre-Cutting System	Multi-Axis Fine Precision Profile Cutter
Wafer Place Accuracy	X-Y: +/- 0.1 mm, Θ : +/- 0.25°
Input & Output	Single Input Wafer Cassette / Wafer Box(Optional) Single Output Wafer Cassette / Wafer Box(Optional) Customer Specified(Sample Supply)
ESD Control	Teflon Plating Wafer Chuck /ESD Blower
Wafer Transfer	Horizontal Multi-link Robot with Bernoulli or Vacuum Effect Hand Wafer Position & Warpage Intelligent Mapping in Cassette
Alignment	Fiber Sensor Non-contact alignment CCD for Pre-cutted tape fine alignment
Control Unit	Standard Industrial PC with 17” Touch Panel LCD Windows 7/10 Professional O/S
Power Supplier	Single Phase AC 220 V, 16A
Air Supplier	60 PSI CDA , 2.5 CFM