ATW200pro Fully Automatic Wafer Taper 衡鵬企業

当社は1999年11月に設立されて以来、国外の高級製造設備、精密測定機械、先進生産材料の輸入に力を注ぎ、中国における企業の生産品質を向上させ、中国の電気電子企業に貢献しています。世界の先進的な生産技術と設備を輸入することによって企業の生産効率のアップ、エネルギーの節約と環境の保護に協力しています。当社と一緒にクリーンな地球と輝く未来をつくりましょう。

ATW200proFully Automatic Wafer Taper

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ATW200pro Fully Automatic Wafer Taper Features：

Advanced ESD roller taping(roller heater as options)

Fully automatic tape feeding & inner Pre-cutting

Configure with multi link wafer transfer robot(Vacuum or Bernoulli arm)

Wafer position & warpage intelligent mapping

Fiber sensor for wafer pre-alignment

CCD for pre-cutted tape alignment

ESD Teflon plating chuck to handle various wafer (chuck heater optional)

Wafer cassette loading & Unloading(Wafer Box as options)

Standard industrial PC control with 17” touch panel LCD

Built-in Ionizers for ESD protection

Lower tension control technology for taping process

ATW200pro Fully Automatic Wafer Taper Specifications：

Wafer Size	Diameter:4”, 5”, 6”& 8” Thickness:50 ~ 725 um(Upgrade to handle thinner wafer capability)
Wafer Type	Si , GaAs Single Flat, Double Flat or V-Notch
Tape Type	Blue Tape or UV Tape or Lamination Tape etc. Width: 120 ~ 240 mm, Length: 100m, Thickness: 0.03 ~ 0.2 mm
Taping Chuck Temp.	Room Temp. ~ 100℃ Controllable (Optional)
Pre-Cutting System	Multi-Axis Fine Precision Profile Cutter
Wafer Place Accuracy	X-Y: +/- 0.1 mm, Θ : +/- 0.25°
Input & Output	Single Input Wafer Cassette / Wafer Box(Optional) Single Output Wafer Cassette / Wafer Box(Optional) Customer Specified(Sample Supply)
ESD Control	Teflon Plating Wafer Chuck /ESD Blower
Wafer Transfer	Horizontal Multi-link Robot with Bernoulli or Vacuum Effect Hand Wafer Position & Warpage Intelligent Mapping in Cassette
Alignment	Fiber Sensor Non-contact alignment CCD for Pre-cutted tape fine alignment
Control Unit	Standard Industrial PC with 17” Touch Panel LCD Windows 7/10 Professional O/S
Power Supplier	Single Phase AC 220 V, 16A
Air Supplier	60 PSI CDA , 2.5 CFM