Wafer Size | Diameter:4”, 5”, 6”& 8” Thickness:50 ~ 725 um(Upgrade to handle thinner wafer capability) |
Wafer Type | Si , GaAs Single Flat, Double Flat or V-Notch |
Tape Type | Blue Tape or UV Tape or Lamination Tape etc. Width: 120 ~ 240 mm, Length: 100m, Thickness: 0.03 ~ 0.2 mm |
Taping Chuck Temp. | Room Temp. ~ 100℃ Controllable (Optional) |
Pre-Cutting System | Multi-Axis Fine Precision Profile Cutter |
Wafer Place Accuracy | X-Y: +/- 0.1 mm, Θ : +/- 0.25° |
Input & Output | Single Input Wafer Cassette / Wafer Box(Optional) Single Output Wafer Cassette / Wafer Box(Optional) Customer Specified(Sample Supply) |
ESD Control | Teflon Plating Wafer Chuck /ESD Blower |
Wafer Transfer | Horizontal Multi-link Robot with Bernoulli or Vacuum Effect Hand Wafer Position & Warpage Intelligent Mapping in Cassette |
Alignment | Fiber Sensor Non-contact alignment CCD for Pre-cutted tape fine alignment |
Control Unit | Standard Industrial PC with 17” Touch Panel LCD Windows 7/10 Professional O/S |
Power Supplier | Single Phase AC 220 V, 16A |
Air Supplier | 60 PSI CDA , 2.5 CFM |