Wafer Size | Diameter:4”, 5”, 6”& 8” Thickness:300 ~ 725 um |
Wafer Type | Si , GaAs Single Flat, Double Flat or V-Notch |
Tape Type | Blue Tape or UV Tape Width:120 ~ 240 mm Length:100 m Thickness:0.03 ~ 0.2 mm |
Taping Temp. | Room Temp. ~ 100 °C Controllable (Optional) |
Cutting System | Multi-Axis Fine Precision Profile Cutter; edge cutter heater, up to 120℃ |
Wafer Place Accuracy | X-Y: +/- 0.2 mm Θ : +/- 0.5° |
Input & Output | Single Input Wafer Cassette / Single Output Wafer Cassette Customer Specified (Sample Supply) |
ESD Control | Ion Blower |
Wafer Transfer | Horizontal Multi-link Robot with Vacuum fork transfer wafer Wafer Position & Warpage Intelligent Mapping in Cassette |
Alignment | Fiber Sensor Non-contact Alignment |
Control Unit | Standard Industrial PC with 15” Touch Panel LCD, Windows7/10 Pro O/S |
Power Supplier | Single Phase AC 220 V, 16A |
Air Supplier | 60 PSI CDA , 2.5 CFM |
Conversion Time | <= 15 Minutes |
Dimensions | 1300 mm (W) ×1500mm(D) ×1750mm(H) |
Machine Construction | Made of Full Aluminium Profile |
Net Weight | 600 Kg around (Specifications items update without notice) |