Mounting Theory | ESD Roller Mounting |
Detaping Theory | Unique Robot Peeling |
Wafer Size | Diameter:8” ~ 12”,Thickness:75 ~ 725 um |
Wafer Type | Si , GaAs etc., V-Notch or Flat |
Tape Type | Non-UV Tape or UV Tape or Pre-cut Tape Width :300 ~ 420 mm, Length:100 m Thickness: 0.05 ~ 0.2 mm |
Wafer Place Accuracy | X-Y: +/- 0. 2 mm Θ : +/- 0.5° |
Detaping Temp. | Room Temp. ~ 150 °C Controllable (Optional) |
Wafer Frame | 8” DISCO or K&S , 12” DISCO or K&S |
Input & Output | Single Wafer Cassette Input / Single Frame Cassette Output |
Wafer Transfer | Horizontal Multi-link Robot with Bernoulli Endeffector Wafer Position Intelligent Mapping in Cassette |
Wafer Alignment | Fiber Sensor for Wafer Alignment |
ESD Control | ESD Roller / ESD Wafer Chuck / ESD Ion Blower |
Cutting System | Adjustable Ring Cutter |
Control Unit | PC with 17” Touch Panel Display |
Power Supplier | Single Phase AC 220 V, 25A |
Air Supplier | 5.0 Kgf/cm2 CDA , 150 L/min |
Machine Construction | Made of Full Aluminium Profiles Extruded |
Machine Cover | SUS304 Stainless Steel Sheet |
Dimensions | 1300 mm (W) × 2500 mm (D) × 1750 mm (H) (Include Load port, exclude tower light) |
Net Weight | 1000 Kg |
Shipping Weight | 1200 Kg |