TTVISION F2XWafer AOI Machine
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    F2X Wafer AOI Machine特長


    5S Surface Inspection

    Inspects Sawing,Metalization&other Surface Defects

    Minimal Overkill&Underkill

    Modular Design

    Cost Effective

    High Throughput


    F2X Wafer AOI Machine仕様


    HANDLING

    PERFORMANCE

    Cassette Size

    Min 5 Inches,

    Max 8 Inches

    Magnification

    2.5X/5X/10X

    Wafer Ring Size

    Min 5 Inches,

    Max 8 Inches

    Accuracy

    2.2/1.1/0.55um

    Onload/Offload

    1

    Repeatability

    4.4/2.2/1.1um

    Cassette Capacity


    Min Defect Size

    15/8/5um

    Wafer Ring Transfer

    Gripper

    Throughput

    16/8/4WPH

    Reject Handling

    e-Mapping 

    with Options

    MTBA

    60min

    OS

    MS Windows 7

    MTBF

    168 hour

    SOFTWARE

    TTVIS10N AOI

    TTVISION OVS

    TTVISION ORM



    DEFECTS INSPECTED

    Patterned Wafer

    Contamination Ink

    Crack/Mesa Damage

    Metalization/Die

    Sawing Offset/Chipping

    Scratches/FM

    Pattern NG/Incomplete Cut

    DoubleCut

    COMMUNICATION

    TCP/IP



    OPERATING ENVIRONMENT

    Temperature

    15 - 24 Degree C

    Humidity

    30 - 80%

    Cleanroom

    Class 10000



    Bumped Wafer

    Bump Size/Bump Defor

    mation/Bump Offset/

    Bump Missing

    OPTIONS

    Reject Handling

    Inking,Sorting



    Offline Station

    Reject Verification

    Recipe Management

    INSPECTION 

    MODE

    100% Sampling



    Cleaning

    Blow Vacuum

    SAFETY

    Interlocked Enclosure

    Jam Protection

    Lock-OutTag-Ou

    HEPA Filter

    Class 1000

    Communication

    SECS/GEM







    FACILITIES




    Size(mm)

    1350(W) x 1100(D) x1700(H)



    Weight

    800 Kg



    Power

    230VAC,50Hz,13A,

    Single Phase



    CDA

    5 - 6 Bars,1CFM



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