TTVISION F271Substrate AOI Machine
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    F271 Substrate AOI Machine特長


    Top&Bottom Surface Inspection

    Inspects Etching,Mechanical,Plating Defects

    Covers Cu,Cu+Ag,Ni(Matt),Ni+Ag&Ni-Pd

    Minimal Overkill&Underkill

    Modular Design

    Cost Effective

    High Throughput


    F271 Substrate AOI Machine仕様


    HANDLING

    PERFORMANCE

    Substrate Size

    Min25(W)x150(L)x0.125(t)mm

    Magnification

    0.7X um

    Max100(W)x300(L)x0.250(t)mm

    Accuracy

    7um

    Stack Height

    200 unit

    Repeatability

    14um

    Onload/Offload

    4unit

    Min Defect Size

    50um

    Input Paper Bin

    800 unit

    Throughput

    360SPH

    Output Paper Stack

    800 unit

    MTBA

    60min

    Substrate Transfer

    Carrier

    MTBF

    168 hour

    Reject Handling

    2 Bins



    OS

    MS Windows 7 

    DEFECTS INSPECTED

    SOFTWARE

    TTVIS10N AOI

    TTVISION OVS

    TTVISION ORM

    PatternedWafer

    BentLead Dented 

    Stain   Wrong Cut

    Scratches ShiftedLead

    Punch Hole Over Etch

    Ag Bleed Coverage 

    Ag Immersion

    Under Etch

    Bridging Tarnish

    MissingTape Ag Flash

    Ag Peeling 

    DamageTape

    Cu Immersion

    Unplated

    Loose Burr

    COMMUNICATION

    TCP/IP



    OPERATING ENVIRONMENT

    Temperature

    15 - 24 Degree C

    Humidity

    30 - 80%

    Cleanroom

    Class 10000



    OPTIONS

    Reject Handling

    eMapping



    Offline Station

    Reject Verification

    Recipe Management

    INSPECTION 

    MODE

    100% Sampling

    Cleaning

    Blow Vacuum

    SAFETY

    Interlocked Enclosure

    Jam Protection

    Lock-OutTag-Ou

    HEPA Filter

    Class 1000

    Communication

    SECS/GEM





    FACILITIES



    Size(mm)

    1850(W)x 1920(D) 

    x 1700(H)



    Weight

    1000 Kg



    Power

    230VAC,50Hz,13A,

    Single Phase



    CDA

    5 - 6 Bars,1CFM



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