TAMURA HC33-32LF3Wave soldering
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    HC33-32LF3 Features:

    · Completely lead-free FLIP type solder bath, high precision preheat

    · Standard gear for spot cooler

    · Optimum soldering has been realized.

    · Secondary nozzle former remote adjustable mechanism,Remote control with note-type personal computer(Option)

    · Central control with touch panel

    · Automatic adjustment of preheating temperature of the printed circuit board

    · Solder dross-less soldering with local N2 hood

    HC33-32LF3 Parameter:

    Applicable boardsMAX. W330×L350×t1.6 (mm)
    Conveyor angle4∼5°
    Conveyor speed0.5∼2.0 m/min
    DimensionsW1320×L3200×H1600( (mm)
    Weight (Excluding solder)Approx. 1500kg
    Soldering capacity (Sn-Pb)Approx. 360kg
    Power sourceAC 200V-50/60Hz-3Φ 34kVA 95A



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