HC33-32LF3 Features:
· Completely lead-free FLIP type solder bath, high precision preheat
· Standard gear for spot cooler
· Optimum soldering has been realized.
· Secondary nozzle former remote adjustable mechanism,Remote control with note-type personal computer(Option)
· Central control with touch panel
· Automatic adjustment of preheating temperature of the printed circuit board
· Solder dross-less soldering with local N2 hood