MALCOM RMS-165LTIn-Line Compact Reflow Oven
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    RMS-165LT Feature:

    · The transportation method (non-stop and step) that becomes the first in the industry can be selected, and the best Profile and Tact Time can be controlled

    · Malcom's unique heater matrix control makes it possible to solder even PC Board thermal capacity bad balance with the most suitable heating

    · Its compact size allows the workspace to be efficiently utilized. Low power consumption provides excellent cost-performance benefits

    · The automatic setting of a temperature profile becomes possible by the combination with the TMR system


    RMS-165LT Specifications:

    ModelRMS-165LT-A (N)
    Size of object Board

    Size: W165 x L 200(mm) 

    Hight: Maintain Upper: 20mm, Lower:15mm

    Equipment SizeW1062.4 x D610 x H1240(mm)
    Heating method

    The upper surface :  Hot wind and far-infrared radiation and radiation using together :  Far-infrared radiation radiate

    Cooling methodLower propeller fan
    Power supply3 phase 200V 50/60Hz 14KVA
    External gas0.30.5Mpa 100ℓ/minMAX
    Oxygen density in-furnaceBelow 100ppm (Nitrogen is used)
    Board maintain methodBoth ends [pinch-n] support
    Heating peak temp330 (Measurement by our specification substrate)
    WeightApprox. 300g




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