Malcom In-Line Compact Reflow Oven RMS-165LT HAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

Product service

Testing
Viscometer
Coplanarity Measurement
SMT Scope
Flying Probe
Solderability
Temperature
Welding
PullTester
optical detecting instrument
Microscope
Thermometer
SPI
X-RAY
Weathering
Production
Welding Materials
Repair equipment
Equipment accessories

MALCOM RMS-165LTIn-Line Compact Reflow Oven

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RMS-165LT Feature:

· The transportation method (non-stop and step) that becomes the first in the industry can be selected, and the best Profile and Tact Time can be controlled

· Malcom's unique heater matrix control makes it possible to solder even PC Board thermal capacity bad balance with the most suitable heating

· Its compact size allows the workspace to be efficiently utilized. Low power consumption provides excellent cost-performance benefits

· The automatic setting of a temperature profile becomes possible by the combination with the TMR system

RMS-165LT Specifications:

Model	RMS-165LT-A (N)
Size of object Board	Size: W165 x L 200(mm) Hight: Maintain Upper: 20mm, Lower:15mm
Equipment Size	W1062.4 x D610 x H1240(mm)
Heating method	The upper surface : Hot wind and far-infrared radiation and radiation using together : Far-infrared radiation radiate
Cooling method	Lower propeller fan
Power supply	3 phase 200V 50/60Hz 14KVA
External gas	0.3～0.5Mpa 100ℓ/min（MAX）
Oxygen density in-furnace	Below 100ppm (Nitrogen is used)
Board maintain method	Both ends [pinch-n] support
Heating peak temp	330℃ (Measurement by our specification substrate)
Weight	Approx. 300g