Malcom Wetting Balance Tester SWB-2 HAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

About Hapoin
Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
News & CSR
Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
Product service
Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
Contact Us
- Contact Us
- Talent Construction
Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

MALCOM SWB-2Wetting Balance Tester

Summary
Parameter
Application
Data
Related
Brand
Video

SWB-2 Feature:

· The entire procedure, from Flux application (w/ Flux Temperature Control Function) to Measurement End is automated. Reducing unstable measurement results, and user error

· Complies with the Wetting test method according to JIS Z3198 (Lead Free Solder Test Method) standards

· Easily change Solder and Flux when necessary

· Efficiently analyze data with the exclusive PC software. (option)

· An optional cover allows for wetting evaluation in a N2 environment. (option)

SWB-2 Specifications:

Load sensor	Principle	Electro-Balance Sensor (EBS)
	Measuring Range	30mN - -30mN
	Accuracy	+/-0.05mN
	Resolution	0.01mN
Temp. Sensor	Measuring Range	0 - 450C
	Accuracy	+/-3C
Insertion Time		1 - 200s
Insertion Depth		0.01 - 20.00mm (0.01mm step)
Insertion Speed		0.1 - 30mm/s
Solder Temp. Setting		Room Temp. - 400C (Micro-wetting : Room Temp. - 320C)
Japanese Standard		Automatic Measurement (Flux Application, Removal and Measurement) , JIS Z3198-4 and C60068-2-54 JEITA ET7401 (Solder Bath)
International Standard		ISO 9455-16 IEC 60068-2-54 and 60068-2-69 (Solder bath) ANSI J-STD-003 MIL STD-883 (Method 2022.2) and IPC TM-650 (2.4.14.2)
N2 Measurement		Oxygen Concentration : 500ppm max. (optional)
Power Supply		AC100V
Outer Dimension		300W x 330D x 370H mm
Weight		Approx. 16kg

*The measurement accuracy of the load sensor excludes the error margin such as the vibrations or others.
*When high-speed infiltrating, the vibration of the table might influence the measurement result.