Malcom Wetting Balance Tester SWB-2 HAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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MALCOM SWB-2Wetting Balance Tester

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Application
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SWB-2 Feature:

· The entire procedure, from Flux application (w/ Flux Temperature Control Function) to Measurement End is automated. Reducing unstable measurement results, and user error

· Complies with the Wetting test method according to JIS Z3198 (Lead Free Solder Test Method) standards

· Easily change Solder and Flux when necessary

· Efficiently analyze data with the exclusive PC software. (option)

· An optional cover allows for wetting evaluation in a N2 environment. (option)

SWB-2 Specifications:

Load sensor	Principle	Electro-Balance Sensor (EBS)
	Measuring Range	30mN - -30mN
	Accuracy	+/-0.05mN
	Resolution	0.01mN
Temp. Sensor	Measuring Range	0 - 450C
	Accuracy	+/-3C
Insertion Time		1 - 200s
Insertion Depth		0.01 - 20.00mm (0.01mm step)
Insertion Speed		0.1 - 30mm/s
Solder Temp. Setting		Room Temp. - 400C (Micro-wetting : Room Temp. - 320C)
Japanese Standard		Automatic Measurement (Flux Application, Removal and Measurement) , JIS Z3198-4 and C60068-2-54 JEITA ET7401 (Solder Bath)
International Standard		ISO 9455-16 IEC 60068-2-54 and 60068-2-69 (Solder bath) ANSI J-STD-003 MIL STD-883 (Method 2022.2) and IPC TM-650 (2.4.14.2)
N2 Measurement		Oxygen Concentration : 500ppm max. (optional)
Power Supply		AC100V
Outer Dimension		300W x 330D x 370H mm
Weight		Approx. 16kg

*The measurement accuracy of the load sensor excludes the error margin such as the vibrations or others.
*When high-speed infiltrating, the vibration of the table might influence the measurement result.