Usage
SP-2 is wettability testing machine for solder paste, parts electrode and PC board, adopted SP-Tension-Method (Temperature Profile Method)
Feature
・Can test and evaluate solder paste, PC board and parts-lead.
・All wetting process can be observed from glass windows.
・"Wetting Balance Measuring Method","Micro-Wetting Balance Measuring Method", and "Quick Heating Method"
are possible optionally.
・Can simulate reflow oven profile with hot air and N2 purge.
・Electro-balance sensor adopted allows detection of very small force.The wettability of microchips can now be
examined by this unit.
・Analyze wetting time and force with exclusive software.
・Solder wire testing is also available.