MALCOM SOLDER-PASTE WETTING TESTER SP-2 HAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

About Hapoin
Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
News & CSR
Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
Product service
Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
Contact Us
- Contact Us
- Talent Construction
Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

Product service

precision measurement
Viscometer
Coplanarity Measurement
SMT Scope
Flying Probe
Solderability
Temperature
Welding
PullTester
optical detecting instrument
Microscope
Thermometer
SPI
X-RAY
Weathering
Production
Soldering Materials
Repair equipment
Equipment accessories

MALCOM SP-2SOLDER-PASTE WETTING TESTER

Feature
Specification
Application
Document
Related Products
Brand
Clip

Usage

SP-2 is wettability testing machine for solder paste, parts electrode and PC board, adopted SP-Tension-Method （Temperature Profile Method)

Feature

・Can test and evaluate solder paste, PC board and parts-lead.

・All wetting process can be observed from glass windows.

・"Wetting Balance Measuring Method","Micro-Wetting Balance Measuring Method", and "Quick Heating Method"
are possible optionally.

・Can simulate reflow oven profile with hot air and N2 purge.

・Electro-balance sensor adopted allows detection of very small force.The wettability of microchips can now be
examined by this unit.

・Analyze wetting time and force with exclusive software.

・Solder wire testing is also available.

Item		Specifications
Load Sensor	Principle	Electro - balance sensor
	Measurement range	10.00gf～－5.00gf
	Measurement accuracy *	± (10mgf + 1 digit)
	Resolution	Less than 900 mgf: 0.001 gf More than 900 mgf: 0.005 gf
Temp. Sensor	Measurement range	0～300℃
	Measurement accuracy	±3℃
Heater unit	Temp. of heater unit	Room temperature ～ 300℃
	O2 Concentration	Simple closed heater unit with nipple for N2 purge test
Temp. profile setting		1. Preheat temp. 2. Preheat time 3. The rate of temp. rise 3℃ /sec. (standard) 4. Maximum temp. 5. Maximum temp. time
Melting point		Preset solder paste melting point
Table movement		Automatic: operated by PC Manual: operated by Up/Down switch (selectable 3 steps speed)
Digital output		RS-232C cable (Malcom format)
Air supply		Original air pressure: 0.2～0.5 Mpa (Approx. 2～5 kgf / cm2) Adjustment air: 0.2 Mpa (Approx. 2kgf / cm2 )
Power supply		AC100V 50 / 60Hz 700W
Weight		Approx. 20kg

*Load sensor accuracy is not concerned oscillation.

sp-2_en