MALCOM SP-2SOLDER-PASTE WETTING TESTER
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    Usage

    SP-2 is wettability testing machine for solder paste, parts electrode and PC board, adopted SP-Tension-Method Temperature Profile Method)

     

    Feature

    Can test and evaluate solder paste, PC board and parts-lead.

    All wetting process can be observed from glass windows.

    "Wetting Balance Measuring Method","Micro-Wetting Balance Measuring Method", and "Quick Heating Method" 
        are possible optionally.

    Can simulate reflow oven profile with hot air and N2 purge.

    Electro-balance sensor adopted allows detection of very small force.The wettability of microchips can now be 
       examined by this unit.

    Analyze wetting time and force with exclusive software.

    Solder wire testing is also available.


     

    Item

    Specifications

    Load   Sensor

    Principle

    Electro -   balance sensor

    Measurement   range

    10.00gf~-5.00gf

    Measurement   accuracy *

    ± (10mgf   + 1 digit)

    Resolution

    Less than   900 mgf: 0.001 gf More than 900 mgf: 0.005 gf

    Temp.   Sensor

    Measurement   range

    0300

    Measurement   accuracy

    ±3

    Heater   unit

    Temp. of   heater unit

    Room   temperature 300

    O2   Concentration

    Simple   closed heater unit with nipple for N2 purge test

    Temp.   profile setting

    1.   Preheat temp.
      2. Preheat time
      3. The rate of temp. rise 3 /sec. (standard)
      4. Maximum temp.
      5. Maximum temp. time

    Melting   point

    Preset   solder paste melting point

    Table   movement

    Automatic:   operated by PC
      Manual: operated by Up/Down switch (selectable 3 steps speed)

    Digital   output

    RS-232C   cable (Malcom format)

    Air   supply

    Original   air pressure: 0.20.5 Mpa (Approx. 25 kgf / cm2)

    Adjustment   air: 0.2 Mpa (Approx. 2kgf / cm2 )

    Power   supply

    AC100V 50   / 60Hz 700W

    Weight

    Approx.   20kg

    *Load sensor accuracy is not concerned oscillation.


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