TAMURA TLF-206-107Pb-Free Solder Paste
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    TLF-206-107 Features:

    · Pb-free (Sn/Ag/Cu series) solder alloy

    · Stable printability with little change in viscosity during continuous printing

    · Stable printability for high print

    · Stable printability after pause on the stencil

    · Reduces void formatin

    · Does not slump in pre-heat

    · Excellent solderability at high temperature

    · Excellent solderability for 0.4mm pithch BGA

    TLF-206-107 Parameter:

    ItemsTLF-206-107Test methods
    Alloy compositionSn95.5/Ag3.9/Cu0.6JIS Z 3282(1999)
    Melting point216~221℃DSC
    Particle size of solder powder20~38μmAccording to laser diffraction method
    Shape of solder powderSphericalJIS Z 3284(1994)
    Flux content11.2%JIS Z 3284(1994)
    Chlorine content0.0%JIS Z 3197(1986)
    Viscosity180Pa・sJIS Z 3284(1994)

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