TAMURA TLF-204G-HFWPb-Free Solder Paste
  • Summary
  • Parameter
  • Application
  • Data
  • Related
  • Brand
  • Video

    LFSOLDER TLF-204G-HFW is a solder paste corresponding to N 2 reflow, consisting of high-reliability flux and Pb-free solder alloy fine powder with developed for printing fine parts. TLF-204G-HFW has stable printability for 0201-chip size pattern, enough tackiness to prevent parts mount error during mounting and excellent defluxibility of flux residue after reflow with semi-water-based cleaner.


     TLF-204G-HFW Features:

    1) A minute solder powder of 15μm or less is used.

    2) A stable printability for 0201-chip size pattern is possible.

    3) An excellent wettability is attained at fine patterns.

    4) Halogen-free flux is used.

    5) Flux residue after reflow can be removed by semi-water based cleaning solvents.


     TLF-204G-HFW Specification:

    Items

    Characteristics

    Test   methods

    Alloy   composition

    Sn96.5/Ag3.0/Cu0.5

    JIS Z 3282(2006)

    Melting point

    216~220℃

    According to   DSC measurement

    Particle size   of solder powder

    5~15 μm

    According to   laser diffraction method

    Flux content

    11.3 %

    JIS Z 3197(2012)

    Chlorine   content

    0.0  %

    JIS Z 3197(2012)

    Viscosity

    190  Pa・s

    JIS Z 3284-3(2014)

    Viscometer,type     PCU, Manufactured by

    Malcom at 25℃


Follow us:

Copyright © 1999-2017 Hapoin Enterprise 沪 ICP 备 11051220 号 沪公网安备 31010502002237号All Rights Reservedbottom.png