TAMURA TLF-204-93IVTPb-Free Solder Paste
  • Summary
  • Parameter
  • Application
  • Data
  • Related
  • Brand
  • Video

     TLF-204-93IVT Features:

    1)   Pb-free (Sn/Ag/Cu series) solder alloy.

    2)   Stable printability with little change in viscosity during continuous printing.

    3)   Reduces void formatin.

    4)   Reduces mid-chip solder balls.

    5)   Does not slump in pre-heat.

    6)   Excellent solderability at high temperature.

    7)   Excellent solderability on fine pitch patterns of 0.5mm pitch CSP.


     TLF-204-93IVT Specification:

    Items

    Characteristics

    Test     methods

    Alloy     composition

    Sn   96.5 / Ag 3.0/ Cu 0.5

    JIS   Z 3282 (1999)

    Melting   point

    216~220℃

    DSC    measurement

    Particle   size of solder powder

    25-38μm

    Laser   diffraction method

    Shape   of solder powder

    Spherical

    Annex   1 to JIS Z 3284 (1994)

    Flux   content

    10.9%

    JIS   Z 3284 (1994)

    Chlorine   content*

    0.0%

    JIS   Z 3197 (1999)

    Viscosity

    220   Pa·s

    Annex   6 to JIS Z 3284 (1994)

    Viscometer    type PCU-205

    manufactured    by Malcom, at 25℃


Follow us:

Copyright © 1999-2017 Hapoin Enterprise 沪 ICP 备 11051220 号 沪公网安备 31010502002237号All Rights Reservedbottom.png