TLF-204-93IVT(SH) Features:

· Pb-free (Sn/Ag/Cu series) solder alloy

· Stable printability with little change in viscosity during continuous printing

· Reduces void formatin

· Reduces mid-chip solder balls

· Does not slump in pre-heat

· Excellent solderability at high temperature

· Excellent solderability on fine pitch patterns of 0.5mm pitch CSP

TLF-204-93IVT(SH) Parameter:

• TAMURATLF-204-NH
  
  TLF-204-NF using unleaded solder alloys (tin, silver, copper) using halogen-free solder flux
• TAMURATLF-204-171
  
  TLF-204-171 is a Pb-free and cleaning-free solder paste used Pb-free spherical solder powder and special flux.
• TAMURATLF-204-MDS
  
  TLF-204-MDS is a Pb-free, no-clean solder paste using Pb-free, spherical solder powder and special flux.
• TAMURATLF-204-NH(20-36)
  
  LFSOLDER TLF-204-NH(20-36) is the Pb-free and Halogen-free solder paste which it used spherical Pb-free solder powder and the halogen-free flux.
• TAMURATLF-801-17
  
  TLF-801-17 is Pb-free solder paste using Pb-free, spherical solder powder and special flux. As the paste contains no Pb, it will largely contribute to the protection of global environment. The melting point of this alloy is close to the Sn/Pb eutectic solder, because this solder paste is composed of Sn/Ag/Bi/In solder alloy. In result, current reflow conditions can be applied.
• TAMURATLF-401-11
  
  TLF-401-11 is the Pb-free solder paste using Pb-free, Sn/Bi series low melting type solder powder and special flux. As the paste contains no Pb, it will largely contribute to the protection of global environment.Furthermore,excellent reliability can be obtained with the flux without washing.