TLF-204-93IVT(SH) Features:
· Pb-free (Sn/Ag/Cu series) solder alloy
· Stable printability with little change in viscosity during continuous printing
· Reduces void formatin
· Reduces mid-chip solder balls
· Does not slump in pre-heat
· Excellent solderability at high temperature
· Excellent solderability on fine pitch patterns of 0.5mm pitch CSP