TAMURA TLF-204-27F4LFSOLDER
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    LFSOLDER TLF-204-27F4 is a solder paste, using special flux and spherical solder powder of Pb-free (SnAgCu).


    As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore,

    excellent reliability can be obtained with the flux without cleaning. Also, residual flux after reflow can be

    removed by hydrocarbon cleaning solvent and semi-water based cleaning solvent etc.


     TLF-204-27F4 Features:

    a) Pb-free (Sn/Ag/Cu series) solder alloy is used.

    b) Residual flux after reflow can be removed by hydrocarbon cleaning solvent and semi-water based cleaning

    solvent etc.

    c) Excellent printability with fine pattern of 0.4mm-Pitch can be obtained.

    d) Being very good in solderability, an adequate wettability is shown for the land and parts.

    e) Excellent solderability can be attained for a high peak temperature.


     TLF-204-27F4 Specification:

    Items

    Characteristics

    Test methods

    Alloy composition

    Sn96.5/Ag3.0/Cu0.5

    JIS Z 3282(1994)

    Melting point

    216~220℃

    According to DSC   measurement

    Particle size of solder powder

    10~25 μm

    According to   laser diffraction method

    Shape of solder Powder

    Spherical

    Annex 1 to JIS Z   3284(1994)

    Flux content

    11.9  %

    JIS Z 3284 (1994)

    Chlorine content

    0.0  %

    JIS Z 3197(1999)

    Viscosity

    180  Pa・s

    Annex 6 to JIS Z   3284(1994)

    Viscometer,type   PCU, Manufactured by

    Malcom at 25℃


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