TAMURA TLF-204-171APb-FREE SOLDER PASTE
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    LFSOLDER TLF-204-171A is the Pb-free and cleaning-free solder paste used Pb-free spherical solder powder and special flux. Since this solde paste contains no Pb, the usage of hazardous materials is reduced, furthermore, the environment and the safe workplace are protected.


     TLF-204-171AFeatures:

    1) Pb-free (Sn/Ag/Cu series) solder alloy is used.

    2) Stable printability and shape of the printed solder paste are obtained with little change in viscosity during continuous printing.

    3) Excellent wettability for electronic component and land pattren.

    4) Excellent solderability is brought with the reflow profile with high peak temperature.

    5) Superior reliability is ensured without cleaning the flux residue.


     TLF-204-171A Specification:

    Items

    Characteristics

    Test methods

    Alloy composition

    Sn 96.5 / Ag 3.0 / Cu 0.5

    JIS Z 3282(1999)

    Melting point

    216~220℃

    DSC measurement

    Particle size of solder powder

    20-38µm

    Laser diffraction method

    Shape of solder powder

    Spherical

    Annex 1 to JIS Z 3284 (1994)

    Flux content

    12.1 %

    JIS Z 3284 (1994)

    Chlorine content ※

    0.0%

    JIS Z 3197 (1999)

    Viscosity

    175Pa・s

    Annex 6 to JIS Z 3284 (1994) Viscometer, type PCU,   manufactured by Malcom., at 25℃

    * Inspected the flux itself only


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