TAMURA TLF-204-167Pb-FREE SOLDER
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    LFSOLDER TLF-204-167 is a Pb-free and cleaning-free solder paste used Pb-free spherical solder


    powder and special flux. Since this solder paste contains no Pb, the usage of hazardous materials is

    reduced, furthermore, the environment and the safe workplace are protected. As its flux residue contains no halides, it can be remained on the PCB without cleaning.



     TLF-204-167Features:

    ・Pb-free (Sn/Ag/Cu series) alloy solder is used.

    ・Stable printability and shape of the printed solder paste are obtained with little change in viscosity during continuous printing.

    ・Chip-side ball seldom occur.

    ・Excellent solderability at high temperature.

    ・Superior reliability is ensured without cleaning the flux residue.


     TLF-204-167 Specification:

    Items

    Characteristics

    Test methods

    Alloy composition

    Sn 96.5 / Ag 3.0/ Cu 0.5

    JIS Z 3282 (1999)

    Melting point

    216~220℃

    DSC measurement

    Particle size of solder powder

    20-38μm

    Laser diffraction method

    Shape of solder powder

    Spherical

    Annex 1 to JIS Z 3284 (1994)

    Flux content

    11.70%

    JIS Z 3284 (1994)

    Chlorine content*

    0.00%

    JIS Z 3197 (1999)

    Viscosity

    200 Pa·s

    Annex 6 to JIS Z 3284 (1994)

    Viscometer type PCU-205

    manufactured by Malcom, at 25℃


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