TAMURA TLF-204-153LFSOLDER
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    LFSOLDER TLF-204-153  is the Pb-free and Halogen-free solder paste which it used spherical Pb-free solder powder and the halogen-free flux. Also, after reflow, the flux residue of this paste becomes with halogen free, because it does not include halogen. Even if this paste corresponds to the fine pattern, because the small solder powder is used excellent printability is obtained. As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore, excellent reliability can be obtained with the flux without washing.



     TLF-204-153 Features:

    1) Pb-free (Sn/Ag/Cu series) solder alloy is used.

    2) Halogen-free flux is used.

    3) Stable printability is obtained with little change in viscosity during continuous printing.

    4) Having a good solderability even in air reflow.

    5) Excellent solderability can be attained for a high peak temperature.

    6) Superior reliability is provided by no washing.


     TLF-204-153 Specification:

    Items

    TLF-204-153

    Test methods

    Alloy composition

    Sn 96.5 / Ag 3.0/ Cu   0.5

    JIS Z 3282 (1999)

    Melting point

    216~220℃

    According to DSC measurement

    Particle size of   solder

    powder

    20~38um

    According to laser diffraction method

    Shape of solder powder

    Spherical

    Annex 1 to JIS Z 3284 (1994)

    Flux content

    12.0%

    JIS Z 3284 (1994)

    Chlorine content

    0.0%

    JIS Z 3197 (1999)

     

    Viscosity

     

    210Pa.s

    Annex 6 to JIS Z 3284 (1994)

    Viscometer, type PCU, manufactured by

    Malcom, at 25℃


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