TAMURA TLF-204-111MPb-Free Solder Paste
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    TLF-204-111M Features:

    · Pb-free (Sn/Ag/Cu series) solder alloy is used

    · Stable printability is obtained with little change in viscosity during continuous printing

    · It is excellent effective for void decrement

    · Chip-side ball seldom occur

    · In preheating, the possibility of slump is very rare

    · Excellent solderability can be attained for a high peak temperature

    · Excellent solderability can be attained at small pattern of 0.5 mm pitch CSP


    TLF-204-111M Parameter:

    ItemsTLF-204-111MTest methods
    Alloy compositionSn95.6/Ag3.0 /Cu0.5JIS Z 3282(1999)
    Melting point216~220℃DSC
    Particle size of solder powder20~38μmAccording to laser diffraction method
    Shape of solder powderSphericalJIS Z 3284(1994)
    Flux content10.9JIS Z 3284(1994)
    Chlorine content0.0JIS Z 3197(1986)
    Viscosity220JIS Z 3284(1994)


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