TAMURA TLF-204-111APb-Free Solder Paste
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    TLF-204-111A Features:

    · Pb-free (Sn/Ag/Cu series) solder alloy is used

    · Stable printability is obtained with little change in viscosity during continuous printing

    · It is excellent effective for void decrement

    · Excellent solderability can be attained for a high peak temperature

    · Excellent solderability can be attained at small pattern of 0.5mm pitch CSP

    · The amount of flux dispersion can be reduced for gold plated board etc

    · Excellent solderability can be attained for gold pad

    · Chip-side ball seldom occur


    TLF-204-111A Parameter:

    ItemsTLF-204-111ATest method
    Alloy compositionSn96.5/Ag3.0/Cu0.5JIS Z 3282(1999)
    Melting point (℃)216~220DSC
    Particle size (μm)25~40According to laser diffraction method
    Shape of solder powderSphericalJIS Z 3284(1994)
    Flux content (%)11.6JIS Z 3284(1994)
    Chlorine content (%)Less than 0.1JIS Z 3197(1986)
    Viscosity (Pa・s)215JIS Z 3284(1994)


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