TAMURA TNP25-538EMReflow Soldering
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    TNP25-538EM Feature:

    Newly designed, heating application for 8 zone (5 preheating and 3 refl ow) profi le construction has realized more detailed time setting for different refl ow peak temperature.

    The compactly designed profi le will be applicable to the parts weak in heat resistance, and also multi-control of heating temperatures will provide suffi cient heating time to assure good quality of solderability.

    Implementation of resource-saving policy

    Successfully reduced amount of electricity and N2 required.

    · Next generation control system

    · Multi-grouping flip flop start

    · Flux recovery rate substantially up

    · Maintenance charge substantially down

    TNP25-538EM Parameter:

    Applicable boardsMAX. W250×L330 (mm)

    MIN. W50×L50 (mm)

    Component height

    Upper 10, 15, 20, 25, 30mm can select

    Lower 10, 15, 20, 25, 30mm can select

    Circuit board put allowance4mm
    N2 Gas supply99.99% 0.4~0.7Mpa 200NL/min
    Flow height from floor900±20mm
    Power sourceAC 200V-50/60Hz-3φ 27kVA 78A

    (at multi grouping flipflop start)

    Dimensions of machineW1310×L5300×H1370 (mm)
    Weightapprox. 2100kg
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