TAMURA TAP30-427EMReflow Soldering
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    TAP30-427EM Feature:

    · Heating efficiency has been improved by ten percent by the new blast hot air blow layout to accomplish smaller

    · The ease of operation and peripheral devices on the control panel. (CD-ROM, mouse)

    · Improved maintainability by the new flux management capability

    · Multi-language selection on operation panel(English, Chinese and Japanese)

    · Useful functions of data filing of histories of equipment, production, etc



    TAP30-427EM Parameter:

    Applicable boards

    MAX. 300×L330 (mm)  

    MIN. 50×L50 (mm)

    Component height

    Upper MAX. 30mm

    Lower MIN. 30mm

    Circuit board put allowance4mm
    N2 Gas supply900±20mm
    Power source

    AC 200V-50/60Hz-3  26kVA 76A  

    (at flipflop start)

    Dimensions of machineW1310×L4200×H1370 (mm)
    Weight

    approx. 1500kg


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