TLF-206-93F Features:

· Pb-free (Sn/Ag/Cu series) solder alloy is used

· Excellent solderability can be attained at small of 0.5mm pitch CSP

· Stable printability is obtained with little change in viscosity during continuous printing

· High reliability flux that conforms to J-STD class L0 flux is used

· Having a good solderability, adequate wettability is shown on various parts

· Excellent solderability can be attained for a high peak temperature

TLF-206-93F Parameter:

• TAMURATLF-204-111M
  
  TLF-204-111M is Pb-free solder paste using Pb-free, shperical solder powder and special flux. As excellent reliability can be obtained with the flux without washing.
• TAMURATLF-204-111A
  
  TLF-204-111A is Pb-free solder paste using Pb-free, spherical solder powder and special flux. As the paste contains no Pb, it will largely contribute to the protection of global environment.
• TAMURATLF-206-107
  
  TLF-206-107 is a Pb-free, no-clean solder paste using Pb-free, spherical solder powder and special flux. Since this solder paste contains no Pb, it reduces hazardous material usage and contributes to protecting the environment and a safer workplace. The flux residue contains no halides and can remain on the board without having to be removed.
• TAMURATLF-401-11
  
  TLF-401-11 is the Pb-free solder paste using Pb-free, Sn/Bi series low melting type solder powder and special flux. As the paste contains no Pb, it will largely contribute to the protection of global environment.Furthermore,excellent reliability can be obtained with the flux without washing.
• TAMURATLF-801-17
  
  TLF-801-17 is Pb-free solder paste using Pb-free, spherical solder powder and special flux. As the paste contains no Pb, it will largely contribute to the protection of global environment. The melting point of this alloy is close to the Sn/Pb eutectic solder, because this solder paste is composed of Sn/Ag/Bi/In solder alloy. In result, current reflow conditions can be applied.
• TAMURATLF-204-167
  
  TAMURA Pb-FREE SOLDER TLF-204-167