TLF-206-93F Features:
· Pb-free (Sn/Ag/Cu series) solder alloy is used
· Excellent solderability can be attained at small of 0.5mm pitch CSP
· Stable printability is obtained with little change in viscosity during continuous printing
· High reliability flux that conforms to J-STD class L0 flux is used
· Having a good solderability, adequate wettability is shown on various parts
· Excellent solderability can be attained for a high peak temperature
TLF-206-93F Parameter:
Items | TLF-206-93F | Test methods |
Alloy composition | Sn96.5/Ag3.0/Cu0.5 | JIS Z 3282(1999) |
Melting point | 216~220℃ | DSC |
Particle size of solder powder | 20~38μm | According to laser diffraction method |
Shape of solder powder | Spherical | JIS Z 3284(1994) |
Flux content | 11.9% | JIS Z 3284(1994) |
Chlorine content | 0.0% | JIS Z 3197(1999) |
Viscosity | 190Pa・s | JIS Z 3284(1994) |
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