TLF-206-107 Features:
· Pb-free (Sn/Ag/Cu series) solder alloy
· Stable printability with little change in viscosity during continuous printing
· Stable printability for high print
· Stable printability after pause on the stencil
· Reduces void formatin
· Does not slump in pre-heat
· Excellent solderability at high temperature
· Excellent solderability for 0.4mm pithch BGA
TLF-206-107 Parameter:
Items | TLF-206-107 | Test methods |
Alloy composition | Sn95.5/Ag3.9/Cu0.6 | JIS Z 3282(1999) |
Melting point | 216~221℃ | DSC |
Particle size of solder powder | 20~38μm | According to laser diffraction method |
Shape of solder powder | Spherical | JIS Z 3284(1994) |
Flux content | 11.2% | JIS Z 3284(1994) |
Chlorine content | 0.0% | JIS Z 3197(1986) |
Viscosity | 180Pa・s | JIS Z 3284(1994) |
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