TAMURA TLF-801-17Pb-Free Solder Paste
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    TLF-801-17 Feature:

    · Pb-free (Sn/Ag/Cu series) solder alloy is used

    · Having a good wettability and solderability

    · The current reflow conditions can be applied

    · Solder balls seldom occur

    · Excellent printability with fine patterns can be obtained

    · Stable printability is obtained with little change in viscosity during continuous printing


    TLF-801-17 Parameter:

    ItemsTLF-801-17Test methods
    Alloy compositionSn88.0/Ag3.5/Bi0.5/In8.0JIS Z 3282(1999)
    Melting point195~209 ℃According to DSC measurement
    Particle size of solder powder20~41μmAccording to laser diffraction method
    Shape of solder powdeSphericalAnnex 1 to JIS Z 3284(1994)
    Flux content11.5%JIS Z 3284(1994)
    Chlorine content0.21%JIS Z 3197(1999)
    Viscosity220 Pa.s

    JIS Z 3284(1994)


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