HARIMA PS57BR-450A-KL1Low temperature solder paste
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    PS57BR-450A-KL1 Parameter:

    ItemTypical valueTest method
    Viscosity170Pa.SMalcom viscometer
    Particle size25-45 μm
    Flux content10.00%JIS-Z-3197
    Halogen content0.30%JIS-Z-3197

    Solder ball test

    (Immediately after printing & after printing 24hrs, JIS-Z-3284)

    harima-1.jpg

    Spreading test


    Copper Board

    Oxidized Copper Board

    Spreading rate(%)

    90%

    89%

    Heat slump

    (Slump of immediately after printing and after heating to 130oCX1minute, JIS-Z-3284)

    harima-2.jpg

    Corrosion

    (Exposed for 72hrs in the chamber at 40oC× 90%RH, JIS-Z-3284)

    harima-3.jpg

    Tackiness

    (Exposed for 72hrs in the chamber at 40oC× 90%RH, JIS-Z-3284)

    harima-4.jpg

    Surface Insulation Resistance

    (JIS-Z-3284:Exposed in the chamber at 85oCX85%RH. Applied 50V DC, measured 100V DC)

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