PS57BR-450A-KL1 Parameter:
Item | Typical value | Test method |
Viscosity | 170Pa.S | Malcom viscometer |
Particle size | 25-45 μm |
|
Flux content | 10.00% | JIS-Z-3197 |
Halogen content | 0.30% | JIS-Z-3197 |
Solder ball test
(Immediately after printing & after printing 24hrs, JIS-Z-3284)

Spreading test
| Copper Board | Oxidized Copper Board |
Spreading rate(%) | 90% | 89% |
Heat slump
(Slump of immediately after printing and after heating to 130oCX1minute, JIS-Z-3284)

Corrosion
(Exposed for 72hrs in the chamber at 40oC× 90%RH, JIS-Z-3284)

Tackiness
(Exposed for 72hrs in the chamber at 40oC× 90%RH, JIS-Z-3284)

Surface Insulation Resistance
(JIS-Z-3284:Exposed in the chamber at 85oCX85%RH. Applied 50V DC, measured 100V DC)
