TAMURA GP-217-HF17Pb-FREE SOLDER PASTE
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    LFSOLDER GP-217-HF17 is a Pb-free and cleaning-free solder paste used Pb-free spherical solde powder and flux. Since this solder paste contains no Pb, the usage of hazardous materials is reduced, furthermore, the and the safe workplace are protected. As its flux residue contains no halides, it can be remained on the PCB cleaning.


     GP-217-HF17 Features:

    ● Pb-free (Sn/Ag/Cu series) solder alloy is used.

    ● Excellent wettability for electronic component and land

    ● Stable printability with little change in viscosity during continuous printing.

    ● Having a good solderability even in air reflow.

    ● Excellent solderability can be attained for a high peak temperature.

    ● Superior reliability is provided by no washing. heater and conveyor during reflowing.


     GP-217-HF17 Specifications:

    Items

    Characteristics

    Test methods

    Alloy composition

    Sn96.1/Ag1.0/Cu0.7/Bi2.0/In0.2

    JIS Z 3282(1999)

    Melting point

    211~222℃

    According to DSC measurement

    Particle size of solder powder

    20-36µm

    According to laser diffraction method

    Flux content

    12.5%

    JIS Z 3284 (1994)

    Chlorine content ※

    0.0%

    JIS Z 3197 (1999)

    Viscosity

    200Pa・s

    Annex 6 to JIS Z 3284 (1994) Viscometer, type PCU,   manufactured by Malcom., at 25℃


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