TAMURA GP-211-167Low Silver Solder Paste
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    GP-211-167 Features:

    · Excellent viscosity stability at continuous printing

    · Stable solder-ability after continuous printing

    ·  Reduction of head-in-pillow phenomenon

    · Reduction of void under QFN





    GP-211-167 Parameter:

    ItemsGP-211-167Test method
    Alloy compositionSn/Ag0.3/Cu0.7
    Melting point (℃)217~227DSC
    Viscosity (Pa・s)200JIS Z 3284(1994)
    Thixotropic index0.53JIS Z 3284(1994)
    Flux content (%)11.9JIS Z 3284(1994)
    Halide content (%)0JIS Z 3197(1999)
    Particle size (μm)20~36Laser diffractometry
    Insulation resistance (Ω)Over 1×109JIS Z 3284(1994)
    Copper corrosionNoneJIS Z 3197(1999)
    Flux typeROL0J-STD 004B


    GP-211-167 Application:

    • · Wind/Solar power generation
    • · Mobile Device
    • · Household appliances
    • · Automotive
    • · LED
    • · FPC
    • · Chip component
    • · Industrial machinery


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