TAMURA RMA-20-31Lead Paste
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    RMA-20-31 Features:

    · The occurrence of “chip side” balls is practically on-existent

    · Residual flux after reflow is uniform. So that defective conductivity “by in-circuit tester” will not occur

    · Having a good solder ability, adequate wettability is shown on various parts

    · Stable printability is obtained with little change in viscosity during continuous printing


    RMA-20-31 Parameter:

    ItemsRMA-20-31Test methods 
    Alloy compositionSn62.8/Pb36.8/Ag0.4JIS Z 3282(1999)
    Melting point179~183℃According to DSC measurement
    Particle size of solder22-38μmAccording to laser diffraction method 
    Shape of solder powderSphericalJIS Z 3284(1994)
    Flux content9.8±0.3%JIS Z 3197(1999)
    Chlorine content 0.0%JIS Z 3197(1999)
    Viscosity160-190Pa・s

    JIS Z 3284(1994) 

    Viscometer, type PCU, manufactured by Malcom at 25℃


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