TAMURA TLF-204-NHPb-Free Solder Paste
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    TLF-204-NH Features:

    · Pb-free (Sn/Ag/Cu series) solder alloy is used

    · Halogen-free flux is used

    · Stable printability is obtained with little change in viscosity during continuous printing

    · Having a good solderability even in air reflow

    · Excellent solderability can be attained for a high peak temperature

    · Superior reliability is provided by no washing


    TLF-204-NH  Parameter:

    ItemsTLF-204-NHTest method
    Alloy compositionSn96.5/Ag3.0/Cu0.5JIS Z 3282(1999)
    Melting point (℃)216~220DSC
    Particle size (μm)25~41Laser diffractometry
    Shape of solder powderSphericalJIS Z 3284 (1994)
    Flux content (%)12JIS Z 3284(1994)
    Chlorine content (%)0JIS Z 3197(1999)
    Viscosity (Pa・s)210JIS Z 3284(1994)



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