TAMURA ULF-210RFlux
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    ULF-210R Features:

    · Flux residue after soldering is light-colored, and remains very little

    · Free of troubles, such as checker pin, etc.  Because of very little flux residue

    · Excellent solderability though low sold component because of almost free of bridges between QDPs or chips and of unwetting of chip lands

    · Excellent flux film reliability because of good compatibility of resin with active ingredient


    ULF-210R Parameter:

    ItemsULF-210RTest method
    AppearanceLight yellow transparent LiquidVisual examination
    Color number1~2Gardener method
    Specific gravity (20℃)0.802JIS Z 3197(1986)
    Viscosity (mPa・s 30℃)3JIS Z 3197(1986)
    Solid content (%)5100℃,1h
    Chlorine content (%)0.0JIS Z 3197(1986)
    Spreading factor (%)88JIS Z 3197(1986)
    Copper plate corrosionPassingJIS Z 3197(1986)
    Insulation resistance(Ω)1×1011JIS Z 3197(1986)


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