贴片/装片 Die Attach
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    Die Attach特点: 


    High-accuracy bonding by unique 3D-NRS technology

    High-productivity and space-saving footprint by adopting twin-head

    High-speed thin die pick-up system with a speed of 400ms / t:20um(option) 

    *Depending on material conditions

    Friction-free bonding head with simultaneous positional and force control for thin die stacked devices

    Cleanness control with HEPA-filter and stainless steel full cover

    Equipped with die back-side camera on each bonding head, 

    enhancing inspection function with a total of 8 cameras

    Capable of handling large substrates up to 120mm width x 300mm length



    Die Attach规格参数: 


    Product Name

    Die Bonder

    Model

    SPA-1000

    Bonding Method

    DAF bonding

    Accuracy             

    XY:±5μm (3σ)、θ:±0.05°(3σ) (Machine accuracy excluding material-induced factors)

    Productivity

    The productivity increased by 2.5 times compared with conventional model.

    (Theoretical value with Shinkawa's standard sample)

    Chip Size

    □0.8 – 25mm

    Wafer Size

    Maximum 12-inch

    Substrate/Leadframe Size

    Width 40 – 120mm

    Length 180 – 300mm

    Thickness0.05 – 0.8mm

    Options Available

    Thin die application kit, Film attachment unit, capability to handle overhead transport (OHT)

    Utilities

    Input Power Supply:Single Phase AC200V±5% 50/60Hz (Other power supply options available on request)

    Power:Maximum 3.2 kVA (3.2kW)

    Consumption

    Air:500kPa (5kgf/cm2) 900 L/min

    Vacuum:Below -74kPa (-550mmHg) (gage)

    Physical Dimensions and Mass

    Approx. 2,280W × 1,510D × 1,670H mm Approx. 2,300 kg

    (excludes monitor display and signal tower)


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