TDM TABLE TOP 翘曲度测试仪/Warpage Analysis
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    TDM-TABLE TOP加热翘曲测试仪/warpage analysis:


       The TDM–TABLE TOP is a versatile instrument for a wide array of applications in the areas of process development, failure analysis, reliability, and quality control.


    ABSOLUTE 3D CARTOGRAPHY FUNCTION OF THE TEMPERATURE


       TDM is a patented tool for warpage analysis under a temperature profile. TDM uses the fringe projection technology (also called projection moiré) for non-contact, full-field acquisition of 3D topographies with a resolution as low as 1 μm. TDM-TT acquires a full, absolute 3D cartography of devices with dimensions up to 75 mm x 75 mm. Simultaneously, its powerful heating and cooling capabilities allow for virtually any temperature profile on the sample under test. The integrated software package provides tools for representation of the results as 3D plots, vectors diagrams, isometrics views and 2D profiles following user-defined profile lines (e.g., diagonal plots).


    型号  

    TDM TABLE TOP  


    Imaging :

    Direct sample illumination, non-contact measurement

    Capabilities :

    Topography analysis: z(x,y) function of the temperature

    Maximum samples size :

    75 mm x 75 mm

    Oven size :

    75 mm x 75 mm

    Field of view (x,y) :

    75 x 75 mm

    Depth of view (z) :

    Up to 20 mm

    CCD camera resolution :

    5 megapixel

    Accuracy :

    +/-1 micron or 2% of measured value, whichever is greater

    (x,y) resolution :

    37.5 μm

    Temperature range :

    Room temperature to 300° C continuous

    Heating method :

    IR lamps - top and bottom

    Heating rate :

    Up to +5° C/s (sample dependent)

    Cooling method :

    Internal ventilation

    Cooling rate :

    Up to -6° C/s above 120° C

    Footprint :

    120 cm x 80 cm x 70 cm

    Weight approx :

    150 kg

    Utilities :

    Electricity : 230 VAC, 50 Hz, single phase




    TDM-TABLE TOP加热翘曲测试仪/warpage analysis-WIDE RANGE OF APPLICATIONS :


    Component characterization: BGA (with/without solder balls), IC, CSP, PoP, etc.

    Component qualification for reflow profile compatibility.

    Component curing process optimization.

    Component and PCB characterization following .

    JEITA-ED-7306 IPC-9641 JEDEC 22B112A.

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