ASEC 39-ICH08低温焊接专用底填胶
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    39-ICH08_ASEC低温焊接专用底填胶特点:


    This product which balanced curing agent. It is possible to obtain characteristic of both LOW CTE and LOW TEMP CURING.



    39-ICH08_ASEC低温焊接专用底填胶Liquid state:


    Property

    Typical Value

    Test Condition

    Chemical

    Epoxy (Black)


    Specific Gravity

    1.4

    @25˚C

    Thixotropic index

    1.0

    12s-1 / 120s-1

    Viscosity

    4.200 mPa・s

    Cone plate type, 120s-1




    39-ICH08_ASEC低温焊接专用底填胶Cured state:


    Property

    Typical Value

    Test Condition

    Tensile Modulus

    4.6 Gpa

    25˚C, DMA

    Tg

    120 ˚C

    DMS

    CTE α1/α2

    39/105  ppm/˚C

    TMA

    Tensile shear strength

    16 Mpa

    JIS K 6850

    Volume resistivity

    2.28 x 1015Ω・cm

    JIS K 6911

    Surface resistivity

    9.7 x 1015Ω

    JIS K 6911

    Dielectric constant

    3.08

    1.0GHz

    3.05

    2.45GHz

    Dielectric loss tangent

    0.015

    1.0GHz

    0.015

    2.45GHz




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