植球 Wafer bump Bonder
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    Wafer Bump Bonder特点: 


    High-speed bonding of 30 ms/bump based on Wire Bonder model UTC-5000

    Capable of handling up to 6-inch wafers by incorporating wafer rotary stage

    ※8-inch wafer handling capability (1 wafer stage) scheduled to be developed

    Equipped with Two wafer stages with temperature up/down control function,

     reducing wafer changeover time and increasing productivity

    Capable of stable 45 μm pad pitch bonding with low vibration, 

    high-speed drive using Shinkawa NRS technology

    Automatic correction of capillary tip position by Shinkawa RPS technology, 

    enabling high accuracy bond placement and reducing work for capillary change

    Automatic free air ball monitor function (FAM) measuring free air ball size

    Multiple choices for surface contact detection at bonding, with "Force detection mode" to detect change 

    in force in real time as well as conventional "Positional detection mode," enabling stable bonding quality



    Wafer Bump Bonder规格参数: 


    Product Name

    Bump Bonder

    Model

    SBB-5200

    Bonding Accuracy

    ±2.5 μm(3σ)Using Shinkawa standard device

    Correction of Bonding Position

    System to check and correct capillary offset prior to bonding through Shinkawa RPS

    Bonding Speed

    30 ms/ bump (without reverse)  Using Shinkawa standard device

    Bonding Wire Length

    8 mm maximum (Varies depending on device conditions)

    Resolution

    XY-table: 0.1 μm  Z-axis: 0.1 μm

    Vibration Control

    Shinkawa NRS - Non Reaction Servo System

    Bonding Area

    Maximum φ150 mm (6-inch wafer)

    Wire Size

    Au φ15–32 μm

    Bonding ForceMaximum 4.9 N
    No. of Bonding Bumps

    30,000 bumps maximum

    Wafer Stage

    2 wafer stages for 6-inch wafers 

    ※with temperature up/down control function

    Wafer Size

    Size:Maximum 6 inches 

    (Conversion parts are required when wafer size changes.)

    Thickness:0.15–0.6 mm

    (Conversion parts may be required when wafer thickness changes.)

    Production Management

    Management of equipment availability through production management monitoring screen

    Options Available

    Automatic wafer loader for 6-inch wafer (Under development)

    Utilities

    Input Power Supply:Single Phase 100 VAC (±5% input variation)  

    50/60Hz (other voltage requires transformer)

    Power Consumption:Approx. 1.1kVA

    CDA:500kPa (5 kgf/cm2) 100L/min

    Vacuum:-74kPa or below (-550 mmHg) (gauge)

    Physical Dimensions and Mass

    1,000W × 1,088D × 2,087H mm  Approx.500 kg


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