倒装焊 Flip Chip Bonder
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    Flip Chip Bonder特点: 


    Chip-to-Wafer Flip chip bonder for NCF-TCB process

    Capable of high-speed, high-precision flip chip bonding by adopting probe camera 

    technology and linear motor

    High precision control of both bond head force and Z position

    Shinkawa’s NRS technology reduced vibration that obstructs fine pitch bonding

    High throughput achieved by short heating and cooling with pulse heater

    Automatic product-type changeover function with capability to bond up to 4 different product-type 

    chips enables handling of 2.5D and 3D stack packaging

    Capable of handling each plunge-up method and thin die pickup

    Capable of handling 12-inch chip wafer and base wafer

    Molten solder detection function and high-precision Z control reduce damage on devices 

    (under low force mode)

    Process monitoring and management function securing stable quality and process portability



    Flip Chip Bonder规格参数: 


    Product Name

    Flip Chip Bonder

    Model

    LFB-2301

    Bonding Method

    Pulse heat thermocompression

    Bonding Accuracy

    ±2μm (3σ) by Shinkawa’s standard condition

    Bonding Force

    1 - 300N

    ※Capable of selecting bond force control method at bonding process

    However, it is not capable of switching over between low force control and high force control in the identical bond profile

    ・Low force Control mode:1 - 50N in 0.1N increments

    ・High force Control mode:10 - 300N in 1N increments

    Bonding Tool Setting Temperature

    RT - 400℃ (in 1℃ increments pulse heat)

    Bonding Stage Setting Temperature

    RT - 150℃ (in 1℃ increments pulse heat)

    Chip Size

    □2 - 20mm t=0.05-0.7mm

    Chip Wafer Size

    φ200mm, φ300mm

    Base Wafer Size

    φ200mm, φ300mm

    ProcessNCF-TCB:Option available:NCP-TCB, Flux-TCB
    Option Available

    Communication Interface SECS Ⅰ/ SECS Ⅱ, HSMS, GEM

    Utilities

    Electricity:Three-phase AC 200V±5% 50/60Hz 

    (if other voltage, consults us)

    Power Consumption:5.0kW Maximum

    CDA:570kPa (5.7kgf/cm2) 250L/min Connection:φ10 Tube 1spot

    Vacuum:Below -74kPa (-550mmHg) (gage) Connection:φ10 Tube 3spots

    Physical Dimensions and Mass

    Approx. 3,292W×1,521D×1,701H mm Approx 3,000kg

    (excludes monitor display, signal tower and load port)


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