Product Name | Flip Chip Bonder |
Model | LFB-2301 |
Bonding Method | Pulse heat thermocompression |
Bonding Accuracy | ±2μm (3σ) by Shinkawa’s standard condition |
Bonding Force | 1 - 300N ※Capable of selecting bond force control method at bonding process However, it is not capable of switching over between low force control and high force control in the identical bond profile ・Low force Control mode:1 - 50N in 0.1N increments ・High force Control mode:10 - 300N in 1N increments |
Bonding Tool Setting Temperature | RT - 400℃ (in 1℃ increments pulse heat) |
Bonding Stage Setting Temperature | RT - 150℃ (in 1℃ increments pulse heat) |
Chip Size | □2 - 20mm t=0.05-0.7mm |
Chip Wafer Size | φ200mm, φ300mm |
Base Wafer Size | φ200mm, φ300mm |
Process | NCF-TCB:Option available:NCP-TCB, Flux-TCB |
Option Available | Communication Interface SECS Ⅰ/ SECS Ⅱ, HSMS, GEM
|
Utilities | Electricity:Three-phase AC 200V±5% 50/60Hz (if other voltage, consults us) |
Power Consumption:5.0kW Maximum |
CDA:570kPa (5.7kgf/cm2) 250L/min Connection:φ10 Tube 1spot |
Vacuum:Below -74kPa (-550mmHg) (gage) Connection:φ10 Tube 3spots |
Physical Dimensions and Mass | Approx. 3,292W×1,521D×1,701H mm Approx 3,000kg (excludes monitor display, signal tower and load port) |